Bending induced electrical response variations in ultra-thin flexible chips and device modeling
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چکیده
منابع مشابه
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
Ultra-thin chips of less than 20 lm become flexible, allowing integration of silicon IC technology with highly flexible electronics such as food packaging sensor systems or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile. The ultra-thin chips in these products will be bent to a very high curvature, which puts a large strain on the chips during use. ...
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